By Gordon Roberts, Friedrich Taenzler, Mark Burns
With the proliferation of advanced semiconductor units containing electronic, analog, mixed-signal, and radio-frequency circuits, modern-day engineer has to be fluent in all 4 circuit varieties. Written for complex undergraduate and graduate-level scholars, in addition to engineering pros, An Introduction to Mixed-Signal IC try out and Measurement, moment version, encompasses analog, mixed-signal and radio-frequency circuits assessments, with many suitable business examples. The textual content assumes a superb history in analog and electronic circuits and a operating wisdom of pcs and machine programming.
An creation to Mixed-Signal IC try out and Measurement, moment version, comprises examples and illustrations--featuring state of the art business technology--to enhance and brighten up the textual content. The ebook additionally introduces large-scale mixed-signal circuit and person circuit assessments, discusses the value-added merits of mixed-signal IC checking out to a manufacturer's product, and obviously defines the position of the try out engineer.
New to This Edition
* a brand new bankruptcy on RF try tools and basics of RF Testing
* a brand new bankruptcy on Clock and Serial info Communications Channel Measurements
* assurance of RF load board design
* New assurance of probabilistic reasoning for mixed-signal trying out
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Additional resources for An Introduction to Mixed-Signal IC Test and Measurement
2 Accuracy, Repeatability, and Correlation Accuracy is a major concern for mixed-signal test engineers. It is very easy to get an answer from a mixed-signal ATE tester that is simply incorrect. Inaccurate answers are caused by a bewildering number of problems. Electromagnetic interference, improperly calibrated instruments, improperly ranged instruments, and measurements made under incorrect test conditions can all lead to inaccurate test results. Repeatability is the ability of the test equipment and test program to give the same answer multiple times.
It is also common to find that two supposedly identical testers or DIB boards give different answers or that the same tester gives different answers from day to day. These problems frequently result from obscure hardware or software errors that may take days to isolate. Correlation efforts can represent a major portion of the time spent debugging a test program. 3 Electromechanical Fixturing Challenges The test head and DIB board must ultimately make contact to the DUT through the handler or prober.
The prober informs the tester when it has placed each new die against the probes of the probe card. The ATE tester then executes a series of electrical tests on the die before instructing the prober to move to the next die. The handshaking between tester and prober insures that the tester only begins testing when a die is in position and that the prober does not move the wafer in midtest. 12 shows a wafer prober and closeup views of a probe card and its probe tips. 3 Handlers Handlers are used to manipulate packaged devices in much the same way that probers are used to manipulate wafers.